Ph.D. (Electrical & Electronics Engineering)- Jan 2022 to Dec 2024 (Expected)

• • Birla Institute of Technology & Sciences (BITS)-Pilani, Hyderabad Campus

  • Topic: “Design and development of indigenously fabricated radiation detectors  ”

  • Supervisors: Dr. Sanket Goel

M.Tech. (VLSI Design and Embedded Systems )- 2009 to 2011

• • RNS Institute of Technology, Visvesvarayya Technological University, Karnataka 

  • Thesis: “Device Driver Development for CC2520 based Mote ” 

B.E ( Electronics and Telecommunication Engineering)-2004 to 2008

• • Sapthagiri College of Engineering, Visvesvarayya Technological University, Karnataka

  • Thesis Title: "An autonomous robot for metal detection on surveillance"

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Journal/Conference  Publication

1. Harsha S, Mohan Kumar, Usha S, Shashi Kumar P V, “Vision based surface roughness evaluation for surface grinding samples”, COPEN-8, National Institute of Technology, Calicut.

2. Harsha S, Deepa R, Kavitha V, Usha S, “Vision based surgical screw inspection”, Advances in Metrology (AdMET-2015), CMERI, Durgapur.

3. Deepa R, Harsha S, Kavitha V, Usha S, “Development of automated vision inspection system for two-wheeler engine crankshaft” Advances in Metrology (AdMET-2015), CMERI, Durgapur.

4. Harsha S, Mahalakshmi S and Alexander George, “Functional evaluation of copper in conventional wire bonding as compared to gold”, Manufacturing Technology Today, Volume 18, Issue3, 2019, pp 62-67

5. Mayuresh K, Harsha S, Usha S, "Design and fabrication of thin film platinum temperature sensor on silicon wafer “, National conference on Microsystems Technologies - 2020, Mar 2020

6. Prabhat Ranjan, Harsha S, Megha Agrawal "Development of signal conditioning system for Biosensor Applications”, National conference on Microsystems Technologies - 2020, Mar 2020

7. Hemanth Kumar Singh, Balaji Subramanian, Kusuma N, Harsha S, "Parametric optimization and analysis of pressure sensor chip membrane using design of experiments (DoE)”, National conference on Microsystems Technologies - 2020, Mar 2020.

8. Sampada Sameer Naik, Harsha S, Megha Agrawal, Mahalakshmi S, “Electrochemical deposition and Characterization of Copper Pillar Bumps –Application towards Flip chip Bonding” 5th International conference on emerging electronics, Indian Institute of Technology-Delhi, 26-28 Nov, 2020

9. Megha Agrawal, Harsha S, “Study on Triple Stack Anodic Bonding Process for MEMS Applications”, 5th International conference on emerging electronics, Indian Institute of Technology-Delhi, 26-28 Nov, 2020

10. Harsha S, Mahalakshmi S, Adarsh Mathew Abraham, Sathwik Dinakar G, “Experimental research of adaptability of palladium coated copper material as an alternative for bare copper or gold material in conventional wire bonding”, 2021 World Congress on Micro Nano Manufacturing, 21 – 23 September 2021, IIT Bombay, Mumbai

11. Jins Abraham, Harsha S, Nisarga K, "Design and Analysis of High Sensitivity MEMS Microphone" Lect.Notes Mechanical Engineering, Bijoy Bhattacharyya et al: Advances in Micro and Nano Manufacturing and Surface Engineering, Springer Nature, July 2022

12.  Nisarga K, Harsha S, “Self-Cleaning Surfaces: a brief on synthesis methodologies and its uses in aerospace applications” Kannada National Science Conference" Science & Technologies of Aerospace & Defence Sectors”, July 2022 at CSIR-NAL. 

13. Karan Pawar, Harsha S, Pradeep Dixit, “Investigation of Cu-Sn-Cu transient liquid phase bonding for microsystems packaging”, Journal of Materials and Manufacturing Processes, July 2022. 

Jul 2016 to current

Scientist C | Central Manufacturing Technology Institute | Bengaluru

•  Design and development of RTD based temperature sensors

•  Hybridization of infrared detectors and read out integrated circuits through flip
    chip bonding

•  Design and development of temperature sensor array for heater temperature
    monitoring in vacuum environment

•  Micro systems design using ANSYS, CoventorWare, SolidWorks, Clewin etc

•  Fabrication processes including lithography procedures viz., Spin coating of
    polymers, pattern transfer through mask aligner, direct pattern writing, mask 
    writing, development, baking, etching and metal liftoff. Thin film deposition of
    metals and dielectrics through electron beam evaporation method. Bulk metal
    deposition through electroplating.

•  Packaging processes viz., wafer dicing, wire bonding, flip chip bonding, wafer
    bonding, sealing and welding.

•  Characterization methods for electrical, mechanical and optical means
    consisting of 4 probes measurement, bond testing for pull and shear forces,
    optical microscopy, X ray inspection.

•  Development of semi-automatic grain sorting machine

•  Internet of Things enabled SMART metal cutting machine with smart sensors
    network.

•  Interfacing of ADXL345 accelerometer with RM46X controller for vibration data
    analysis of machine tools.

Apr 2012 to Jun 2016

Scientist B | Central Manufacturing Technology Institute | Bengaluru

•  Vision based surface roughness evaluation for surface grinding samples

•  Vision based surgical screw inspection

•  Vision and motion control using embedded hardware

•  Programming and simulation of industrial robot.

•  Infrastructure development for micro systems fabrication, packaging and
    characterization consisting of ISO 5, ISO 6, ISO 7 and ISO 8 clean rooms with
    necessary utilities.

•  Machine Health Management System: Interfacing of ADXL345 accelerometer
    with TMS320C5535 controller for data analysis for machine fault diagnosis.

Sept 2011 to Apr 2012

Graduate Engineer | Central Manufacturing Technology Institute | Bengaluru

•  Vision systems design and development for inline non contact defect inspection
      and dimensional metrology

Sept 2008 to May 2009

System Engineer | Hewlett Packard | Bengaluru

Harsha S

MEMS & SENSORS Group

Centre for Sensors, Vision Technology and Controls

Central Manufacturing Technology Institute

Tumkur Road, Bengaluru, Karnataka - 560022

Email: harsha@cmti.res.in